Junction Temperature Consistency Analysis of MMC Submodule

Zhuo Chen, Yumei Guo, Xiangming Wang

Abstract


Although modular multilevel converter（MMC）is currently widely used in the field of DC power transmission due to its excellent topology performance, the natural DC bias characteristics inevitably cause thermal imbalance of internal devices. Too high temperature at the junction of power devices is one of the major causes of damage. Therefore, it is necessary to further investigate the factors that affect the device junction temperature. This paper calculated the power loss and junction temperature by combined the thermal impedance model and compared junction temperature under two typical modulation strategies .


Keywords


Modular Multilevel Converter; Modulation Strategy; Power Loss; Junction Temperature Fluctuation

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References


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Wu Cong, M., Avenas, Y., Miscevic, M., Wang, M.X., Mitova, R., Lavieville, J.P., Lasserre,P. (2014) Thermal analysis of a submodule for modular multilevel converters. In: Applied Power Electronics Conference and Exposition. Fort Worth. pp. 2675-2681.




DOI: https://doi.org/10.18686/esta.v8i1.175

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